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Proceedings Paper

Research on ultrafast laser polishing monocrystalline-silicon
Author(s): Xiao Gang Li; Jun Han; Hui Xie; PengFei Zhu
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Paper Abstract

Laser polishing technique using thermal effect of the interaction of light with matter to achieve removal of material, it is a non contact polishing techniques. In recent years, ultra fast laser polishing techniques got great progress, when ultra fast laser matter interaction, no thermal effect or thermal effect is very small, the removal of material is achieved primarily through momentum transfer. In the material removal process will appear the phenomenon of surface atoms in the redistribution, using this effect, we are likely to achieve the manufacture of the ultra smooth surface of atomic scale magnitude. This article has discussed and analyzed the mechanism of ultra fast laser semiconductor materials, based on this, parameters and their influence on the influence of ultra fast laser polished monocrystalline silicon effects were studied. Used the orthogonal experiment method to optimize the main parameters of the laser polishing, it can reach to a better combination of optimized parameter values. Used self-built picosecond laser polishing system and did monocrystalline silicon polishing experiment, got a good polishing effect.

Paper Details

Date Published: 19 February 2015
PDF: 6 pages
Proc. SPIE 9449, The International Conference on Photonics and Optical Engineering (icPOE 2014), 944926 (19 February 2015); doi: 10.1117/12.2075792
Show Author Affiliations
Xiao Gang Li, Xi'an Technological Univ. (China)
Jun Han, Xi'an Technological Univ. (China)
Hui Xie, Xi'an Research Institute of Applied Optics (China)
PengFei Zhu, Xi'an Technological Univ. (China)


Published in SPIE Proceedings Vol. 9449:
The International Conference on Photonics and Optical Engineering (icPOE 2014)
Ailing Tian; Anand Asundi; Weiguo Liu; Chunmin Zhang, Editor(s)

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