Share Email Print

Proceedings Paper

Negative e-beam resists using for nano-imprint lithography and silicone mold fabrication
Author(s): S. L. Shy; Anil Kumar T.V.; Gene Sheu; Shao-Ming Yang; M. C. Chen; C. S. Hong
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Nano-imprinting technology, as one of the most promising fabrication technologies, has been demonstrated to be a powerful tool for large-area replication up to wafer-level, with features down to nanometer scale. This study aims to develop capabilities in patterning nano structure using thermal nano-imprint lithography (NIL). 30nm Si molds are patterned by electron-beam lithography (EBL) using NEB22 A2 negative e-beam resist. The NEB22 A2 negative e-beam resist possess a variety of characteristics desirable for NIL, such as low viscosity, low bulk-volumetric shrinkage, high Young's modulus, high thermal stability, and excellent dry-etch resistance. The excellent oxygenetch resistance of the barrier material enables a final transfer pattern that is about three times higher than that of the original NIL mold. Based on these imprint on negative electron beam resist approach is used for pattern transfer into silicon substrates. The result is a high-resolution pattern with feature sizes in the range of nanometer to several microns.

Paper Details

Date Published: 19 March 2015
PDF: 8 pages
Proc. SPIE 9423, Alternative Lithographic Technologies VII, 94231M (19 March 2015); doi: 10.1117/12.2075381
Show Author Affiliations
S. L. Shy, National Nano Device Labs. (Taiwan)
Anil Kumar T.V., Asia Univ. (Taiwan)
Gene Sheu, Asia Univ. (Taiwan)
Shao-Ming Yang, Asia Univ. (Taiwan)
M. C. Chen, National Nano Device Labs. (Taiwan)
C. S. Hong, National Nano Device Labs. (Taiwan)

Published in SPIE Proceedings Vol. 9423:
Alternative Lithographic Technologies VII
Douglas J. Resnick; Christopher Bencher, Editor(s)

© SPIE. Terms of Use
Back to Top