Share Email Print
cover

Proceedings Paper

Hybrid III-V/silicon SOA for photonic integrated circuits
Author(s): P. Kaspar; R. Brenot; A. Le Liepvre; A. Accard; D. Make; G. Levaufre; N. Girard; F. Lelarge; G.-H. Duan; S. Olivier; Christophe Jany; C. Kopp; S. Menezo
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Silicon photonics has reached a considerable level of maturity, and the complexity of photonic integrated circuits (PIC) is steadily increasing. As the number of components in a PIC grows, loss management becomes more and more important. Integrated semiconductor optical amplifiers (SOA) will be crucial components in future photonic systems for loss compensation. In addition, there are specific applications, where SOAs can play a key role beyond mere loss compensation, such as modulated reflective SOAs in carrier distributed passive optical networks or optical gates in packet switching. It is, therefore, highly desirable to find a generic integration platform that includes the possibility of integrating SOAs on silicon. Various methods are currently being developed to integrate light emitters on silicon-on-insulator (SOI) waveguide circuits. Many of them use III-V materials for the hybrid integration on SOI. Various types of lasers have been demonstrated by several groups around the globe. In some of the integration approaches, SOAs can be implemented using essentially the same technology as for lasers. In this paper we will focus on SOA devices based on a hybrid integration approach where III-V material is bonded on SOI and a vertical optical mode transfer is used to couple light between SOI waveguides and guides formed in bonded III-V semiconductor layers. In contrast to evanescent coupling schemes, this mode transfer allows for a higher confinement factor in the gain material and thus for efficient light amplification over short propagation distances. We will outline the fabrication process of our hybrid components and present some of the most interesting results from a fabricated and packaged hybrid SOA.

Paper Details

Date Published: 13 November 2014
PDF: 7 pages
Proc. SPIE 9277, Nanophotonics and Micro/Nano Optics II, 927708 (13 November 2014); doi: 10.1117/12.2074617
Show Author Affiliations
P. Kaspar, III-V Lab. (France)
R. Brenot, III-V Lab. (France)
A. Le Liepvre, III-V Lab. (France)
A. Accard, III-V Lab. (France)
D. Make, III-V Lab. (France)
G. Levaufre, III-V Lab. (France)
N. Girard, III-V Lab. (France)
F. Lelarge, III-V Lab. (France)
G.-H. Duan, III-V Lab. (France)
S. Olivier, MINATEC (France)
Christophe Jany, MINATEC (France)
C. Kopp, MINATEC (France)
S. Menezo, MINATEC (France)


Published in SPIE Proceedings Vol. 9277:
Nanophotonics and Micro/Nano Optics II
Zhiping Zhou; Kazumi Wada, Editor(s)

© SPIE. Terms of Use
Back to Top