
Proceedings Paper
Qualification of local advanced cryogenic cleaning technology for 14nm photomask fabricationFormat | Member Price | Non-Member Price |
---|---|---|
$14.40 | $18.00 |
![]() |
GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. | Check Access |
Paper Abstract
The march toward tighter design rules, and thus smaller defects, implies stronger surface adhesion between defects and
the photomask surface compared to past generations, thereby resulting in increased difficulty in photomask cleaning.
Current state-of-the-art wet clean technologies utilize functional water and various energies in an attempt to produce
similar yield to the acid cleans of previous generations, but without some of the negative side effects. Still, wet cleans
have continued to be plagued with issues such as persistent particles and contaminations, SRAF and feature damages,
leaving contaminants behind that accelerate photo-induced defect growth, and others.
This paper details work done through a design of experiments (DOE) utilized to qualify an improved cryogenic cleaning
technology for production in the Advanced Mask Technology Center (AMTC) advanced production lines for 20 and 14
nm processing. All work was conducted at the AMTC facility in Dresden, Germany utilizing technology developed by
Eco-Snow Systems and RAVE LLC for their cryogenic local cleaning VC1200F platform. This system uses a newly
designed nozzle, improved gaseous CO2 delivery, extensive filtration to remove hydrocarbons and minimize particle
adders, and other process improvements to overcome the limitations of the previous generation local cleaning tool.
AMTC has successfully qualified this cryogenic cleaning technology and is currently using it regularly to enhance
production yields even at the most challenging technology nodes.
Paper Details
Date Published: 17 October 2014
PDF: 7 pages
Proc. SPIE 9235, Photomask Technology 2014, 923525 (17 October 2014); doi: 10.1117/12.2074473
Published in SPIE Proceedings Vol. 9235:
Photomask Technology 2014
Paul W. Ackmann; Naoya Hayashi, Editor(s)
PDF: 7 pages
Proc. SPIE 9235, Photomask Technology 2014, 923525 (17 October 2014); doi: 10.1117/12.2074473
Show Author Affiliations
Ralf Taumer, Advanced Mask Technology Ctr. GmbH & Co. KG (Germany)
Thorsten Krome, Advanced Mask Technology Ctr. GmbH & Co. KG (Germany)
Chuck Bowers, Eco-Snow Systems (United States)
Ivin Varghese, Eco-Snow Systems (United States)
Thorsten Krome, Advanced Mask Technology Ctr. GmbH & Co. KG (Germany)
Chuck Bowers, Eco-Snow Systems (United States)
Ivin Varghese, Eco-Snow Systems (United States)
Tyler Hopkins, Eco-Snow Systems (United States)
Roy White, RAVE LLC (United States)
Martin Brunner, RAVE LLC (United States)
Daniel Yi, RAVE LLC (United States)
Roy White, RAVE LLC (United States)
Martin Brunner, RAVE LLC (United States)
Daniel Yi, RAVE LLC (United States)
Published in SPIE Proceedings Vol. 9235:
Photomask Technology 2014
Paul W. Ackmann; Naoya Hayashi, Editor(s)
© SPIE. Terms of Use
