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Proceedings Paper

Optimization of indium bump preparation in infrared focal plane array fabrication
Author(s): Zhijin Hou; Junjie Si; Wei Wang; Haizhen Wang; Liwen Wang
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Paper Abstract

Optimization of indium bump preparation in infrared focal plane array (IRFPA) fabrication is presented. Reasons of bringing defective pixels during conventional lift-off and cleanout process in fabrication of indium bump are discussed. IRFPAs are characterized by IRFPA test-bench. Results show that defective pixels of InSb IRFPA are owing to indium bumps connecting through indium residue on the surface of wafer. The characteristic and configuration of defective pixels of InSb IRFPA are given and analyzed. A method of reducing defective pixels through optimizing liftoff and cleanout process in InSb IRFPA is proposed. Results prove that this method is effective.

Paper Details

Date Published: 20 November 2014
PDF: 5 pages
Proc. SPIE 9300, International Symposium on Optoelectronic Technology and Application 2014: Infrared Technology and Applications, 93000U (20 November 2014); doi: 10.1117/12.2071086
Show Author Affiliations
Zhijin Hou, Luoyang Opto-electro Technology Development Ctr. (China)
Junjie Si, Luoyang Opto-electro Technology Development Ctr. (China)
Wei Wang, Luoyang Opto-electro Technology Development Ctr. (China)
Haizhen Wang, Luoyang Opto-electro Technology Development Ctr. (China)
Liwen Wang, Luoyang Opto-electro Technology Development Ctr. (China)


Published in SPIE Proceedings Vol. 9300:
International Symposium on Optoelectronic Technology and Application 2014: Infrared Technology and Applications
Mircea Guina; Haimei Gong; Zhichuan Niu; Jin Lu, Editor(s)

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