Share Email Print

Proceedings Paper

Effects of annealing in silicon nitride film deposited by inductively coupled plasma CVD on GaN
Author(s): Xiu-juan Liu; Ni-li Wang; Yan Zhang; Xiang-yang Li
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Silicon nitride (SiNx) films on GaN were deposited, using the inductively coupled plasma chemical vapor deposition (ICPCVD) method with different radio-frequency chuck power (RF power). After deposition, all the films were annealed at 750℃ in N2, and some pins and bubbles were observed on the surface of some films, but this phenomenon was not observed on the films which were deposited with RF power=0W, as well as films deposited by a two-step-deposition method, which was consisted of setting RF power=0W at the beginning, and setting RF power=2W after that. To study the mechanism of origin of these pins and bubbles, Atomic force microscopy(AFM) was performed to study surface morphology and measure the height of the pins and bubbles, it was found that the height of bubbles was about 300nm, and the depth of pins was about 300nm, which were almost the same as the film thickness. It was showed that the pins and bubbles were originated from gas escaping from the inner films after high-temperature annealing. X-ray photoelectron spectra(XPS) was used to characterize the chemical composition of the films before and after annealing, independently. It was found that, on GaN-SiNx interface and SiNx film surface, the N element content decreased a lot after annealing, but N content remained almost the same in those films with RF power=0W. which indicated that reducing of N content was closely related with those pins and bubbles. RF power increased the plasma energy and caused GaN surface damage. The ion bombardment broke some N-Si bonds and N-Ga bonds, as a result some N reactants didn’t perform as Si-N bond, but performed in other bonds such as N-H bonds or N-N bonds, and a high-temperature annealing process would cause NH3 or N2 escape from the film. The pins were voids which resulted from the film broken by the gas, and the bubbles came from bulge resulted from gas escape.

Paper Details

Date Published: 20 November 2014
PDF: 6 pages
Proc. SPIE 9300, International Symposium on Optoelectronic Technology and Application 2014: Infrared Technology and Applications, 93000J (20 November 2014); doi: 10.1117/12.2070657
Show Author Affiliations
Xiu-juan Liu, Shanghai Institute of Technical Physics (China)
Univ. of Chinese Academy of Sciences (China)
Ni-li Wang, Shanghai Institute of Technical Physics (China)
Yan Zhang, Shanghai Institute of Technical Physics (China)
Xiang-yang Li, Shanghai Institute of Technical Physics (China)

Published in SPIE Proceedings Vol. 9300:
International Symposium on Optoelectronic Technology and Application 2014: Infrared Technology and Applications
Mircea Guina; Haimei Gong; Zhichuan Niu; Jin Lu, Editor(s)

© SPIE. Terms of Use
Back to Top