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Proceedings Paper

Efficient model-based dummy-fill OPC correction flow for deep sub-micron technology nodes
Author(s): Ayman Hamouda; Mohamed Salama
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Paper Abstract

Dummy fill insertion is a necessary step in modern semiconductor technologies to achieve homogeneous pattern density per layer. This benefits several fabrication process steps including but not limited to Chemical Mechanical Polishing (CMP), Etching, and Packaging. As the technology keeps shrinking, fill shapes become more challenging to pattern and require aggressive model based optical proximity correction (MBOPC) to achieve better design fidelity. MBOPC on Fill is a challenge to mask data prep runtime and final mask shot count which would affect the total turnaround time (TAT) and mask cost. In our work, we introduce a novel flow that achieves a robust and computationally efficient fill handling methodology during mask data prep, which will keep both the runtime and shot count within their acceptable levels. In this flow, fill shapes undergo a smart MBOPC step which improves the final wafer printing quality and topography uniformity without degrading the final shot count or the OPC cycle runtime. This flow is tested on both front end of line (FEOL) layers and backend of line (BEOL) layers, and results in an improved final printing of the fill patterns while consuming less than 2% of the full MBOPC flow runtime.

Paper Details

Date Published: 16 September 2014
PDF: 9 pages
Proc. SPIE 9235, Photomask Technology 2014, 92351W (16 September 2014); doi: 10.1117/12.2070544
Show Author Affiliations
Ayman Hamouda, GLOBALFOUNDRIES Inc. (United States)
Mohamed Salama, GLOBALFOUNDRIES Inc. (United States)

Published in SPIE Proceedings Vol. 9235:
Photomask Technology 2014
Paul W. Ackmann; Naoya Hayashi, Editor(s)

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