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Proceedings Paper

Application of EB repair for high durable MoSi PSM
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Paper Abstract

Recently there has been a demand for high durability MoSi masks. There are some candidates for MoSi mask materials. They are preferable for both mask user and mask manufacture because they show not only high durability against exposure or cleaning process but also process compatibility in production line[1]. They are gaining momentum to practical application. However, there is a drawback for manufacturing regarding the mask repair process. Because ebeam repair employs pure chemical reaction, it faces severe etching difficulty due to higher chemical stability. Meanwhile, the tool supplier has looked into that chemical reaction in detail since the problem was unveiled. They developed a dedicated etching process for high durable materials. It’s so important for the mask manufacturer to evaluate this process properly before they transfer conventional MoSi to new high durability MoSi. A comprehensive understanding of this new process should be acquired by trying several kinds of etching tests. In this paper we will report the results ranging from basic etching rate, selectivity, repair accuracy to flexibility for complicated shaped defects. This data tells us a lot about if it can be applied for practical use. The experiment was performed with e-beam repair tool “MeRiT”, which was released as the latest version from ZEISS last year. An improved new etching process was applied to “A6L2” type high durable blanks provided by HOYA corporation. A wide variety of programmed defects were arranged on a line and space featured test mask. These programmed defects were repaired with the procedure developed by ZEISS. After repair, printed image was evaluated by AIMSTM system. This paper will discuss the initial results of these first steps into the uncharted territory of high durability MoSi repair.

Paper Details

Date Published: 28 July 2014
PDF: 8 pages
Proc. SPIE 9256, Photomask and Next-Generation Lithography Mask Technology XXI, 92560U (28 July 2014); doi: 10.1117/12.2070019
Show Author Affiliations
Shingo Kanamitsu, Toshiba Corp. (Japan)
Keiko Morishita, Toshiba Corp. (Japan)
Takashi Hirano, Toshiba Corp. (Japan)


Published in SPIE Proceedings Vol. 9256:
Photomask and Next-Generation Lithography Mask Technology XXI
Kokoro Kato, Editor(s)

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