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Proceedings Paper

Subsurface damage detection and damage mechanism analysis of chemical-mechanical polished optics
Author(s): Hui Ye; Wei Yang; Guo Bi; Ping Yang; Yinbiao Guo
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Paper Abstract

Detection of the subsurface damage depth in optical elements has significance on the subsequent material removal amount and improving element surface quality. The paper focuses on the subsurface damage of chemical-mechanical polished K9 specimen, and analyses the chemical-mechanical polishing mechanism and the cause of subsurface damage. A most suitable etchant is chosen and the step-by-step etching method is applied to measure the subsurface damage depth. A microscope is used to detect the damage morphology and the variation trend at different depth. Research shows that the subsurface damage caused by chemical-mechanical polishing is Hertz scratch, and the scratch quantity below surface presents a variation of zero-more-less-disappeared. The K9 specimen is polished for 3 min under the pressure of 2.5 Kgf and the spindle speed of 43139 r/min, thus resulting in a subsurface damage depth 15.3μm.

Paper Details

Date Published: 18 September 2014
PDF: 6 pages
Proc. SPIE 9282, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment, 928203 (18 September 2014); doi: 10.1117/12.2069273
Show Author Affiliations
Hui Ye, Xiamen Univ. (China)
Wei Yang, Xiamen Univ. (China)
Guo Bi, Xiamen Univ. (China)
Ping Yang, Xiamen Univ. (China)
Yinbiao Guo, Xiamen Univ. (China)


Published in SPIE Proceedings Vol. 9282:
7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment
Yudong Zhang; Wei Gao, Editor(s)

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