Share Email Print

Proceedings Paper

Best-practice evaluation-methods for wafer-fab photomask-requalification inspection tools
Author(s): Chan Seob Cho; Ashish Mungmode; Ron Taylor; David Cho; Hui Peng Koh
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Requalifying semiconductor photomasks remains critically important and is increasingly challenging for 20nm and 14nm node logic reticles. Patterns are becoming more complex on the photomask, and defect sensitivity requirements are more stringent than ever before. Reticle inspection tools are equally important for effective process development and the successful ramp and sustained yield for high volume manufacturing. The inspection stages considered were: incoming inspection to match with Mask Shop Outgoing result and to detect defects generated during transport; requalification by routine cycle inspection to detect Haze and any other defects; and inspection by in-house or Mask shop at the post cleaning. There are many critical capability and capacity factors for the decision for best inspection tool and strategy for high volume manufacturing, especially objective Lens NA, wavelength, power, pixel size, throughput, full-automation inspection linked with Overhead Transport, algorithm application, engineering application function, and inspection of PSM and OMOG . These tools are expensive but deliver differentiated value in terms of performance and throughput as well as extendibility. Performing a thorough evaluation and making a technically sound choice which explores these many factors is critical for success of a fab. This paper examines the methodology for evaluating two different photomask inspection tools. The focus is on ensuring production worthiness on real and advanced product photomasks requiring accurate evaluation of sensitivity, throughput, data analysis function and engineering work function on those product photomasks. Photomasks used for data collection are production reticles, PDM(Program defect Mask), SiN spray defect Reticle which is described that evaluates how the tools would perform on a contaminated plate.

Paper Details

Date Published: 8 October 2014
PDF: 8 pages
Proc. SPIE 9235, Photomask Technology 2014, 92351I (8 October 2014); doi: 10.1117/12.2068466
Show Author Affiliations
Chan Seob Cho, GLOBALFOUNDRIES Inc. (United States)
Ashish Mungmode, GLOBALFOUNDRIES Inc. (United States)
Ron Taylor, GLOBALFOUNDRIES Inc. (United States)
David Cho, GLOBALFOUNDRIES Inc. (United States)
Hui Peng Koh, GLOBALFOUNDRIES Inc. (United States)

Published in SPIE Proceedings Vol. 9235:
Photomask Technology 2014
Paul W. Ackmann; Naoya Hayashi, Editor(s)

© SPIE. Terms of Use
Back to Top