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Proceedings Paper

A low-temperature bridge-input CMOS circuit for low-impedance detector
Author(s): HongHui Yuan; YongPing Chen
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Paper Abstract

Low-impedance long-wave infrared detectors (the wavelength longer than 10 microns) have very important applications in cryogenic aim detection, super-distance detection, anti-jamming target identify and so on. Therefore the research in the field of infrared detector technology is of importance. At present, no low-impedance photoconductive detectors are integrated with CMOS circuit. To design low-temperature CMOS circuit being fit for low impedance infrared photoconductive detector and realize high performance IR imaging, using differential amplifier with symmetrical positive and negative power is necessary, the low-resist detector is connected between an input and grounding, the corresponding low resistance is connected between another input and grounding, a larger feedback resistor is used between negative input and output, this structure can effectively solve the matching problem of low-impedance and high-impedance CMOS. In addition, the noise voltage from VBIAS terminal can be effectively reduced by increasing the ratio of the bias resistor and the detector resistance. The whole circuit is designed two grade. The first grade is adopted bridge input structure, this structure is fit for low impedance detector. The positive amplifying method is applied in second grade . The first grade feedback resistance is designed 1M ohm, the circuit is supplied by ±1.5V. The testing showed that the circuit can work well when it connects with low-impedance infrared photoconductive detector at the liquid nitrogen low temperature. The magnification is up to 30000 times, 3dB bandwidth is more than 4kHz, the equivalent input noise is near 1.5 micron volts. This circuit has perfectly solved the matching problem between high impedance CMOS circuit and low impedance detector.

Paper Details

Date Published: 2 September 2014
PDF: 6 pages
Proc. SPIE 9284, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronics Materials and Devices for Sensing and Imaging, 92841D (2 September 2014); doi: 10.1117/12.2068377
Show Author Affiliations
HongHui Yuan, Shanghai Institute of Technical Physics (China)
YongPing Chen, Shanghai Institute of Technical Physics (China)


Published in SPIE Proceedings Vol. 9284:
7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronics Materials and Devices for Sensing and Imaging
Yadong Jiang; Junsheng Yu; Bernard Kippelen, Editor(s)

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