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Proceedings Paper

Simulation of terahertz metamaterial absorbers with microbolometer structure
Author(s): Jie Ding; Jun Wang; Xiaopei Guo; Yadong Jiang; Lin Fan
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Paper Abstract

The metamaterial absorber in terahertz (THz) region, with the metal pattern layer/dielectric spacer/metal reflective layer sandwich structure, is characterized in this paper. The principle of metamaterial absorber absorbing terahertz wave was introduced firstly. The top layer of metamaterial absorber is a periodically patterned with metallic subwavelength structure, which also serves as an electric resonator. The bottom layer is a thick metal plane, which is used to reduce THz wave transmittance. The dielectric layer between two metallic layers results in magnetic resonance and the resonance depends on the thickness and dielectric constant of the dielectric layer. The absorption of metamaterial absorber to terahertz wave was simulated with CST software. The relationship between the size of the metamaterial structure and absorption frequency was analyzed with the simulation results. The results indicate that the absorption frequency is affected by the cell constant and geometric structure of top metal pattern, and absorption rate is related to both the thickness of dielectric layer and the size of resonator. In the end, the possibility of integrating the metamaterial absorber with micro-bridge structure to design room temperature terahertz detector was discussed, and the manufacturing process was introduced about room temperature terahertz detector with high THz wave absorption rate.

Paper Details

Date Published: 2 September 2014
PDF: 7 pages
Proc. SPIE 9284, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronics Materials and Devices for Sensing and Imaging, 92841E (2 September 2014); doi: 10.1117/12.2068152
Show Author Affiliations
Jie Ding, Univ. of Electronic Science and Technology of China (China)
Jun Wang, Univ. of Electronic Science and Technology of China (China)
Xiaopei Guo, Univ. of Electronic Science and Technology of China (China)
Yadong Jiang, Univ. of Electronic Science and Technology of China (China)
Lin Fan, Univ. of Electronic Science and Technology of China (China)


Published in SPIE Proceedings Vol. 9284:
7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronics Materials and Devices for Sensing and Imaging
Yadong Jiang; Junsheng Yu; Bernard Kippelen, Editor(s)

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