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Proceedings Paper

Optical multichannel parallel chip-to-chip data distribution
Author(s): Holger Karstensen; Hartmut W. Schneider; A. Staudt; Helmut Zarschizky; Christian Gerndt; Ekkehard Klement; Harald Tischer
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Paper Abstract

The design and the modelling results of an 8 channel parallel optical chip to chip interconnection consisting of a laser diode (LD) array, a single-mode waveguide (WG) array, and a photodiode (PD) array with 8 channels each are presented. The separation of the channels is 125 im, so the overall width of the 8 channel line is only I mm. The electronic and the optoelectronic components will be mounted on a silicon substrate wafer and the waveguides on a second silicon wafer which will be fixed upside down on the substrate. The LDs are envisaged to be AlGaAs singlequantum well types though the first implementation will be realized with conventional A1GaAs MCRW semiconductor lasers with a wavelength of 0.85 rim. The PDs are fabricated in standard silicon technology, the silica WGs with the flame hydrolysis technique and reactive ion etching. The trade off between large fabrication tolerances and the desired high coupling efficiencies is discussed. Mounting techniques for the LD- and PD-arrays are presented. A comparison between this optical interconnection and an equivalent electrical one is given.

Paper Details

Date Published: 1 August 1990
PDF: 10 pages
Proc. SPIE 1281, Optical Interconnections and Networks, (1 August 1990); doi: 10.1117/12.20676
Show Author Affiliations
Holger Karstensen, Siemens AG (Germany)
Hartmut W. Schneider, Siemens AG (Germany)
A. Staudt, Siemens AG (Germany)
Helmut Zarschizky, Siemens AG (Germany)
Christian Gerndt, Siemens AG (Germany)
Ekkehard Klement, Siemens AG (Germany)
Harald Tischer, Siemens AG (Germany)


Published in SPIE Proceedings Vol. 1281:
Optical Interconnections and Networks
Hartmut Bartelt, Editor(s)

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