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Proceedings Paper

EBM-9000: EB mask writer for product mask fabrication of 16nm half-pitch generation and beyond
Author(s): Hidekazu Takekoshi; Takahito Nakayama; Kenichi Saito; Hiroyoshi Ando; Hideo Inoue; Noriaki Nakayamada; Takashi Kamikubo; Rieko Nishimura; Yoshinori Kojima; Jun Yashima; Akihito Anpo; Seiichi Nakazawa; Tomohiro Iijima; Kenji Ohtoshi; Hirohito Anze; Victor Katsap; Steven Golladay; Rodney Kendall
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Paper Abstract

In the half pitch (hp) 16nm generation, the shot count on a mask is expected to become bipolar. The multi-patterning technology in lithography seems to maintain the shot count around 300G shots instead of increase in the number of masks needed for one layer. However, as a result of mask multiplication, the better positional accuracy would be required especially in Mask-to-Mask overlay. On the other hand, in complex OPC, the shot count on a mask is expected to exceed 1T shots. In addition, regardless of the shot count forecast, the resist sensitivity needs to be lower to reduce the shot noise effect so as to get better LER. In other words, slow resist would appear on main stream, in near future. Hence, such trend would result in longer write time than that of the previous generations. At the same time, most mask makers request masks to be written within 24 hours. Thus, a faster mask writer with better writing accuracy than those of previous generations is needed. With this background, a new electron beam mask writing system, EBM- 9000, has been developed to satisfy such requirements of the hp 16nm generation. The development of EBM-9000 has focused on improving throughput for larger shot counts and improving the writing accuracy.

Paper Details

Date Published: 17 October 2014
PDF: 8 pages
Proc. SPIE 9235, Photomask Technology 2014, 92350X (17 October 2014); doi: 10.1117/12.2065551
Show Author Affiliations
Hidekazu Takekoshi, NuFlare Technology, Inc. (Japan)
Takahito Nakayama, NuFlare Technology, Inc. (Japan)
Nuflare Technology,Inc. (Japan)
Kenichi Saito, Nuflare Technology, Inc. (Japan)
NuFlare Technology, Inc. (Japan)
Hiroyoshi Ando, NuFlare Technology, Inc. (Japan)
Hideo Inoue, NuFlare Technology, Inc. (Japan)
Noriaki Nakayamada, Nuflare Technology, Inc. (Japan)
Takashi Kamikubo, NuFlare Technology, Inc. (Japan)
Rieko Nishimura, NuFlare Technology, Inc. (Japan)
Yoshinori Kojima, NuFlare Technology, Inc. (Japan)
Jun Yashima, NuFlare Technology, Inc. (Japan)
Akihito Anpo, NuFlare Technology, Inc. (Japan)
Seiichi Nakazawa, NuFlare Technology, Inc. (Japan)
Tomohiro Iijima, NuFlare Technology, Inc. (Japan)
Kenji Ohtoshi, NuFlare Technology, Inc. (Japan)
Hirohito Anze, NuFlare Technology, Inc. (Japan)
Victor Katsap, NuFlare Technology, Inc. (United States)
Steven Golladay, NuFlare Technology, Inc. (United States)
Rodney Kendall, NuFlare Technology, Inc. (United States)


Published in SPIE Proceedings Vol. 9235:
Photomask Technology 2014
Paul W. Ackmann; Naoya Hayashi, Editor(s)

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