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Proceedings Paper

Intelligent CMOS imaging
Author(s): Peter B. Denyer; David Renshaw; Stewart Smith
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Paper Abstract

We report on the integration of computational and control functions with image sensor arrays using commodity CMOS processes. The sensors are highly efficient, high density arrays of photo-diodes, with a minimal overhead of one transistor per pixel. We report production arrays of up to 786 X 576 pixels of 10.5 micrometers pitch in 0.8 micrometers double metal single poly CMOS. We also report techniques presently in development to achieve 7.5 micrometers pitch in the same technology. These sensors are fully self-contained with regard to drive and sense electronics. Typical off-chip needs are limited to a clock crystal, supply regulator and some decoupling capacitors. `Intelligence' is provided in the form of analogue and digital functions integrated on the same chip as the sensors. Such functions can include 8- bit ADC, on-chip exposure control and computational functions to achieve color restoration. Integration of these parts allows us to construct a single chip color camera. Results from a proto-type color CMOS camera system are given. Successful realization of these functions leads to order of magnitude reductions in system cost, size and power-consumption when compared to the CCD alternative.

Paper Details

Date Published: 10 April 1995
PDF: 7 pages
Proc. SPIE 2415, Charge-Coupled Devices and Solid State Optical Sensors V, (10 April 1995); doi: 10.1117/12.206525
Show Author Affiliations
Peter B. Denyer, VLSI Vision Ltd. (United Kingdom)
David Renshaw, VLSI Vision Ltd. (United Kingdom)
Stewart Smith, VLSI Vision Ltd. (United Kingdom)

Published in SPIE Proceedings Vol. 2415:
Charge-Coupled Devices and Solid State Optical Sensors V
Morley M. Blouke, Editor(s)

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