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Proceedings Paper

Modular high-performance 2-um CCD-BiCMOS process technology for application-specific image sensors and image sensor systems on a chip
Author(s): R. Michael Guidash; P. P. K. Lee; J. M. Andrus; Antonio S. Ciccarelli; H. J. Erhardt; J. R. Fischer; Eric J. Meisenzahl; Robert H. Philbrick; Timothy J. Kenney
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Paper Abstract

A 2 micrometers BiCMOS process module has been developed for incorporation into existing high performance 2-phase CCD processes, to enable integration of digital and analog circuits on- chip with the CCD image sensor. The modular process architecture allows the integration of CMOS, NPN bipolar or BiCMOS circuits without affecting the baseline CCD characteristics. A design of experiments approach was employed using process and device simulation tools and selected physical experiments, to optimize CMOS and NPN device performance and process latitude. Both enhancement and depletion mode Poly-1 and Poly-2 CMOS devices were realized and demonstrated good long channel behavior down to 1.6 micrometers drawn. A 12 V, 2.5 GHz, low collector resistance NPN was also produced. Experimental process splits were used to demonstrate and verify that the CMOS and NPN process module incorporation did not affect the CCD device characteristics or yield. CMOS circuit performance was found to be comparable to that of a standard 2 micrometers CMOS process. Finally, a trilinear sensor with on-chip timing generation and correlated double sample was designed and fabricated. To our knowledge this is the first demonstration of high performance CCD, 2 micrometers CMOS, and an isolated vertical NPN, integrated on the same chip.

Paper Details

Date Published: 10 April 1995
PDF: 9 pages
Proc. SPIE 2415, Charge-Coupled Devices and Solid State Optical Sensors V, (10 April 1995); doi: 10.1117/12.206521
Show Author Affiliations
R. Michael Guidash, Eastman Kodak Co. (United States)
P. P. K. Lee, Eastman Kodak Co. (United States)
J. M. Andrus, Eastman Kodak Co. (United States)
Antonio S. Ciccarelli, Eastman Kodak Co. (United States)
H. J. Erhardt, Eastman Kodak Co. (United States)
J. R. Fischer, Eastman Kodak Co. (United States)
Eric J. Meisenzahl, Eastman Kodak Co. (United States)
Robert H. Philbrick, Eastman Kodak Co. (United States)
Timothy J. Kenney, Eastman Kodak Co. (United States)

Published in SPIE Proceedings Vol. 2415:
Charge-Coupled Devices and Solid State Optical Sensors V
Morley M. Blouke, Editor(s)

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