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Proceedings Paper

Three dimensional profile measurement using multi-channel detector MVM-SEM
Author(s): Makoto Yoshikawa; Sumito Harada; Keisuke Ito; Tsutomu Murakawa; Soichi Shida; Jun Matsumoto; Takayuki Nakamura
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Paper Abstract

In next generation lithography (NGL) for the 1x nm node and beyond, the three dimensional (3D) shape measurements such as side wall angle (SWA) and height of feature on photomask become more critical for the process control. Until today, AFM (Atomic Force Microscope), X-SEM (cross-section Scanning Electron Microscope) and TEM (Transmission Electron Microscope) tools are normally used for 3D measurements, however, these techniques require time-consuming preparation and observation. And both X-SEM and TEM are destructive measurement techniques. This paper presents a technology for quick and non-destructive 3D shape analysis using multi-channel detector MVM-SEM (Multi Vision Metrology SEM), and also reports its accuracy and precision.

Paper Details

Date Published: 28 July 2014
PDF: 10 pages
Proc. SPIE 9256, Photomask and Next-Generation Lithography Mask Technology XXI, 92560G (28 July 2014); doi: 10.1117/12.2064944
Show Author Affiliations
Makoto Yoshikawa, Advantest Corp. (Japan)
Sumito Harada, Advantest Corp. (Japan)
Keisuke Ito, Advantest Corp. (Japan)
Tsutomu Murakawa, Advantest Corp. (Japan)
Soichi Shida, Advantest Corp. (Japan)
Jun Matsumoto, Advantest Corp. (Japan)
Takayuki Nakamura, Advantest Corp. (Japan)


Published in SPIE Proceedings Vol. 9256:
Photomask and Next-Generation Lithography Mask Technology XXI
Kokoro Kato, Editor(s)

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