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Proceedings Paper

How holistic process control translates into high mix logic fab APC?
Author(s): B. Le-Gratiet; M. Gatefait; J. Ducotè; J. Decaunes; A. Lam; B. Beraud; M. Mikolajczak; A. Pelletier; B. Orlando; F. Sundermann; A. Ostrovsky; C. Lapeyre
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Paper Abstract

Advanced CMOS nodes require more and more information to get the wafer process well setup. Process tool intrinsic capabilities are not sufficient to secure specifications. APC systems (Advanced Process Control) are being developed in waferfab to manage process context information to automatically adjust and tune wafer processing. The APC manages today Run to Run component from and between various process steps plus a sub-recipes/profiles corrections management. This paper will outline the architecture of an integrated/holistic process control system for a high mix advanced logic waferfoundry.

Paper Details

Date Published: 17 October 2014
PDF: 9 pages
Proc. SPIE 9231, 30th European Mask and Lithography Conference, 92310V (17 October 2014); doi: 10.1117/12.2064795
Show Author Affiliations
B. Le-Gratiet, STMicroelectronics (France)
M. Gatefait, STMicroelectronics (France)
J. Ducotè, STMicroelectronics (France)
J. Decaunes, STMicroelectronics (France)
A. Lam, STMicroelectronics (France)
B. Beraud, STMicroelectronics (France)
M. Mikolajczak, STMicroelectronics (France)
A. Pelletier, STMicroelectronics (France)
B. Orlando, STMicroelectronics (France)
F. Sundermann, STMicroelectronics (France)
A. Ostrovsky, STMicroelectronics (France)
C. Lapeyre, STMicroelectronics (France)


Published in SPIE Proceedings Vol. 9231:
30th European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)

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