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Proceedings Paper

Cost-effective optoelectronic packaging for multichip modules and backplane level optical interconnects
Author(s): Julian P. G. Bristow; Yue Liu; Terry Marta; Sommy Bounnak; Klein Johnson; Yung-Sheng Liu; Herbert S. Cole
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Paper Abstract

Optical backplanes are of increasing interest for commercial and military avionic processors, and for commercial supercomputers. Projected interconnection density limits of electrical interconnects are rapidly becoming a bottleneck, preventing optimal exploitation of electronic processor capability. A potential obstacle to the commercial development of optoelectronic interconnect components for backplane-based systems is the small market for such specialized technology. In order to ensure that a cost effective solution is available for backplane based systems, commonality with a higher volume application is required. We describe optical packaging techniques for board level waveguides and multichip modules which exploit materials, processes and equipment already in widespread use in the electronics industry, and which can also be applied to a wide range of optoelectronic modules for local area network and telecommunications applications. Rugged polyetherimide waveguides with losses of 0.24 dB/cm have been integrated with conventional circuit board materials, and optoelectronic die have been packaged in a multichip module process using equipment normally used for purely electronic packaging. Practical optical interfaces and connectors have been demonstrated for board-to-backplane and board-to-multichip module applications, and offer increased pincount over their electrical counterparts while retaining compatibility with existing electrical connector alignment and fabrication tolerances.

Paper Details

Date Published: 5 April 1995
PDF: 13 pages
Proc. SPIE 2400, Optoelectronic Interconnects III, (5 April 1995); doi: 10.1117/12.206334
Show Author Affiliations
Julian P. G. Bristow, Honeywell Technology Ctr. (United States)
Yue Liu, Honeywell Technology Ctr. (United States)
Terry Marta, Honeywell Technology Ctr. (United States)
Sommy Bounnak, Honeywell Technology Ctr. (United States)
Klein Johnson, Honeywell Technology Ctr. (United States)
Yung-Sheng Liu, GE Corporate Research and Development Ctr. (United States)
Herbert S. Cole, GE Corporate Research and Development Ctr. (United States)


Published in SPIE Proceedings Vol. 2400:
Optoelectronic Interconnects III
Ray T. Chen; Harvard Scott Hinton, Editor(s)

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