Share Email Print

Proceedings Paper

Optical interconnects for multiprocessors in computer backplane
Author(s): Tae-Jin Kim; Kun-Yii Tu; Darrell Ramsey; Tchang-Hun Oh; Raymond K. Kostuk
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Optical interconnects have potential advantage over electrical methods at the backplane level. In this paper we present a free-space optical connection cube for backplane interconnect applications. The connection cube has a symmetric structure which reduces skew between boards. It can be expanded into a 3-dimensional configuration for parallel communication using vertical-cavity surface-emitting laser (VCSEL) and receiver arrays. Fan-out and fan-in of propagation beams for the connection cube are realized using volume holographic optical elements formed in dichromated gelatin (DCG) emulsion. A four-port communication system has been demonstrated using the connection cube and tested at 500 MHz. In this paper, advantages and detailed implementation of the free-space optical connection cube are presented. Design considerations for fan-out/in holographic gratings and alignment tolerances for the connection cube are discussed. Characteristics of the connection cube are also presented.

Paper Details

Date Published: 5 April 1995
PDF: 12 pages
Proc. SPIE 2400, Optoelectronic Interconnects III, (5 April 1995); doi: 10.1117/12.206309
Show Author Affiliations
Tae-Jin Kim, Optical Sciences Ctr./Univ. of Arizona (United States)
Kun-Yii Tu, Optical Sciences Ctr./Univ. of Arizona (United States)
Darrell Ramsey, Optical Sciences Ctr./Univ. of Arizona (United States)
Tchang-Hun Oh, Optical Sciences Ctr./Univ. of Arizona (United States)
Raymond K. Kostuk, Optical Sciences Ctr./Univ. of Arizona (United States)

Published in SPIE Proceedings Vol. 2400:
Optoelectronic Interconnects III
Ray T. Chen; Harvard Scott Hinton, Editor(s)

© SPIE. Terms of Use
Back to Top