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Proceedings Paper

New optical waveguide structure: a trench-channel-type high-density waveguide in Si
Author(s): Tohru Nakamura; Takeshi Kato; Tomonori Tanoue; Fumio Murai; Mitsuo Takeda
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Paper Abstract

A new optical waveguide suitable for high-packing-density OEICs is proposed. The waveguides are embedded in trenches, with large depth/width ratios, in a silicon substrate. The spacing between the waveguides and their pitch were less than 2 micrometers and 4 micrometers , respectively. This structure enables ultra high density optical interconnections in a silicon substrate.

Paper Details

Date Published: 5 April 1995
PDF: 6 pages
Proc. SPIE 2400, Optoelectronic Interconnects III, (5 April 1995); doi: 10.1117/12.206298
Show Author Affiliations
Tohru Nakamura, Hitachi, Ltd. (Japan)
Takeshi Kato, Hitachi, Ltd. (Japan)
Tomonori Tanoue, Hitachi, Ltd. (Japan)
Fumio Murai, Hitachi, Ltd. (Japan)
Mitsuo Takeda, Univ. of Electro-Communications (Japan)

Published in SPIE Proceedings Vol. 2400:
Optoelectronic Interconnects III
Ray T. Chen; Harvard Scott Hinton, Editor(s)

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