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Proceedings Paper

Processing of ceramics by excimer lasers
Author(s): Isamu Miyamoto; Hiroshi Maruo
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Paper Abstract

Processing of S13N4 arid Zr02 ceramics was rerformed by using ArF , KrF and XeF excimer lasers with mainly mask projection, and characteristics of ceramic processing and surface appearance were analyzed. Focused excimer laser beam from unstable resonator was also used for cutting, and compared with focused c02 and YAG lasers of nonnal pulse. Material removal process of excimer lasers was compared with O2 and YAG lasers of normal pulse on the basis of energy analysis, X-ray diffraction and spectral analysis during ablation of Si3N4 . It was found that in material processing by 002 and YAG lasers, Si3N4 is decomposed into N and liquid Si, which attaches to the surface, producing roughened surface with cracks . On the other hand, in excimer laser processing, Si3N4 is decomposed into Si. (g) and N with accompanying ionized Si by its high peak power , resulting in excellent quality of processing without deposition of decomposed materials . The mechanism of uneven laser processing in Si3N4 and Zr02 ceramics was also discussed.

Paper Details

Date Published: 1 August 1990
PDF: 11 pages
Proc. SPIE 1279, Laser-Assisted Processing II, (1 August 1990); doi: 10.1117/12.20622
Show Author Affiliations
Isamu Miyamoto, Osaka Univ. (Japan)
Hiroshi Maruo, Osaka Univ. (Japan)

Published in SPIE Proceedings Vol. 1279:
Laser-Assisted Processing II
Lucien Diego Laude, Editor(s)

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