Share Email Print
cover

Proceedings Paper

Interactive alignment and image reconstruction for wafer-level multi-aperture camera systems
Author(s): Alexander Oberdörster; Andreas Brückner; Hendrik P. A. Lensch
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Assembly of miniaturized high-resolution cameras is typically carried out by active alignment. The sensor image is constantly monitored while the lens stack is adjusted. When sharpness is acceptable in all regions of the image, the lens position over the sensor is fixed. For multi-aperture cameras, this approach is not sufficient. During prototyping, it is beneficial to see the complete reconstructed image, assembled from all optical channels. However, typical reconstruction algorithms are high-quality offline methods that require calibration. As the geometric setup of the camera repeatedly changes during assembly, this would require frequent re-calibration. We present a real-time algorithm for an interactive preview of the reconstructed image during camera alignment. With this algorithm, systematic alignment errors can be tracked and corrected during assembly. Known imperfections of optical components can also be included in the reconstruction. Finally, the algorithm easily maps to very simple GPU operations, making it ideal for applications in mobile devices where power consumption is critical.

Paper Details

Date Published: 23 September 2014
PDF: 8 pages
Proc. SPIE 9217, Applications of Digital Image Processing XXXVII, 921715 (23 September 2014); doi: 10.1117/12.2060678
Show Author Affiliations
Alexander Oberdörster, Fraunhofer-Institut für Angewandte Optik und Feinmechanik (Germany)
Andreas Brückner, Fraunhofer-Institut für Angewandte Optik und Feinmechanik (Germany)
Hendrik P. A. Lensch, Eberhard Karls Univ. Tübingen (Germany)


Published in SPIE Proceedings Vol. 9217:
Applications of Digital Image Processing XXXVII
Andrew G. Tescher, Editor(s)

© SPIE. Terms of Use
Back to Top