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Proceedings Paper

Compact multispectral photodiode arrays using micropatterned dichroic filters
Author(s): Eric V. Chandler; David E. Fish
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Paper Abstract

The next generation of multispectral instruments requires significant improvements in both spectral band customization and portability to support the widespread deployment of application-specific optical sensors. The benefits of spectroscopy are well established for numerous applications including biomedical instrumentation, industrial sorting and sensing, chemical detection, and environmental monitoring. In this paper, spectroscopic (and by extension hyperspectral) and multispectral measurements are considered. The technology, tradeoffs, and application fits of each are evaluated. In the majority of applications, monitoring 4-8 targeted spectral bands of optimized wavelength and bandwidth provides the necessary spectral contrast and correlation. An innovative approach integrates precision spectral filters at the photodetector level to enable smaller sensors, simplify optical designs, and reduce device integration costs. This method supports user-defined spectral bands to create application-specific sensors in a small footprint with scalable cost efficiencies. A range of design configurations, filter options and combinations are presented together with typical applications ranging from basic multi-band detection to stringent multi-channel fluorescence measurement. An example implementation packages 8 narrowband silicon photodiodes into a 9x9mm ceramic LCC (leadless chip carrier) footprint. This package is designed for multispectral applications ranging from portable color monitors to purpose- built OEM industrial and scientific instruments. Use of an eight-channel multispectral photodiode array typically eliminates 10-20 components from a device bill-of-materials (BOM), streamlining the optical path and shrinking the footprint by 50% or more. A stepwise design approach for multispectral sensors is discussed – including spectral band definition, optical design tradeoffs and constraints, and device integration from prototype through scalable volume production. Additional customization options are explored for application-specific OEM sensors integrated into portable devices using multispectral photodiode arrays.

Paper Details

Date Published: 28 May 2014
PDF: 9 pages
Proc. SPIE 9101, Next-Generation Spectroscopic Technologies VII, 91010A (28 May 2014); doi: 10.1117/12.2053500
Show Author Affiliations
Eric V. Chandler, Pixelteq, Inc. (United States)
David E. Fish, Pixelteq, Inc. (United States)


Published in SPIE Proceedings Vol. 9101:
Next-Generation Spectroscopic Technologies VII
Mark A. Druy; Richard A. Crocombe, Editor(s)

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