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Proceedings Paper

Modelling and predicting hidden solder joint shape using active thermography and parametric numerical analysis
Author(s): Jose Benjamin Giron Palomares; Sheng-Jen Hsieh
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Paper Abstract

A methodology based on active infrared thermography to study and characterize hidden solder joint shapes on a multi cover PCB assembly was investigated. A numerical model was developed to simulate the active thermography methodology and was proven to determine the grand average cooling rates with maximum errors of 8.85% (one cover) and 13.36% (two covers). A parametric analysis was performed by varying the number of covers, heat flux provided, and the amount of heating time. Grand average cooling rate distances among contiguous solder joint shapes, as well as solder joints discriminability, were determined to be directly proportional to heat flux, and inversely proportional to the number of covers and heating time. Finally, a mathematical model was developed to determine the appropriate total amount of energy needed to discriminate among hidden solder joints with a “good” discriminability for one and two covers, and a “regular” discriminability for up to five covers. The mathematical model was proven to predict the total amount of energy to achieve a “good” discriminability for one cover within a 10% of error with respect to the experimental active thermography model.

Paper Details

Date Published: 21 May 2014
PDF: 11 pages
Proc. SPIE 9105, Thermosense: Thermal Infrared Applications XXXVI, 91050Q (21 May 2014); doi: 10.1117/12.2053393
Show Author Affiliations
Jose Benjamin Giron Palomares, Texas A&M Univ. (United States)
Sheng-Jen Hsieh, Texas A&M Univ. (United States)


Published in SPIE Proceedings Vol. 9105:
Thermosense: Thermal Infrared Applications XXXVI
Gregory R. Stockton; Fred P. Colbert; Sheng-Jen (Tony) Hsieh, Editor(s)

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