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Proceedings Paper

High-density silicon optical interposer for inter-chip interconnects
Author(s): T. Nakamura; Y. Urino; Y. Arakawa
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Paper Abstract

We introduce a photonics-electronics convergence system and a silicon optical interposer in this system. We developed the optical components for the silicon optical interposer and achieved a high-bandwidth-density silicon optical interposer of 30 Tbps/cm2 with a channel line rate of 20 Gbps.

Paper Details

Date Published: 1 May 2014
PDF: 4 pages
Proc. SPIE 9133, Silicon Photonics and Photonic Integrated Circuits IV, 91330R (1 May 2014); doi: 10.1117/12.2052891
Show Author Affiliations
T. Nakamura, Institute for Photonics–Electronics Convergence System Technology (Japan)
Photonics Electronics Technology Research Association (Japan)
Y. Urino, Institute for Photonics–Electronics Convergence System Technology (Japan)
Photonics Electronics Technology Research Association (Japan)
Y. Arakawa, Institute for Photonics–Electronics Convergence System Technology (Japan)
The Univ. of Tokyo (Japan)


Published in SPIE Proceedings Vol. 9133:
Silicon Photonics and Photonic Integrated Circuits IV
Laurent Vivien; Seppo Honkanen; Lorenzo Pavesi; Stefano Pelli; Jung Hun Shin, Editor(s)

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