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Proceedings Paper

Design, fabrication and characterization of miniaturized high resolution camera modules
Author(s): M. Kuehn; M. Goetz; C. Mueller; H. Reinecke
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Paper Abstract

Camera systems become more and more important in everyday life. Some of those systems place special requirements concerning the environmental conditions they are exposed to especially in harsh environment. High temperature and humidity difficult to access areas require individual packaging and joining technologies for the setup of a camera module. Environmental conditions have an influence on optical design and tolerance calculation. In case of high temperatures the different thermal expansion coefficients of the used materials lead to stress in joints, lenses and their fittings. This, in turn, can lead to a loss of adjustment of the mechanical and optical components that have a direct influence on the optical performance of the camera module. The recent work shows the development of miniaturized high resolution camera modules designed for use in harsh environment applications.

Paper Details

Date Published: 2 May 2014
PDF: 12 pages
Proc. SPIE 9130, Micro-Optics 2014, 91300J (2 May 2014); doi: 10.1117/12.2052464
Show Author Affiliations
M. Kuehn, Univ. Freiburg (Germany)
M. Goetz, HSG-IMIT (Germany)
C. Mueller, Univ. Freiburg (Germany)
H. Reinecke, Univ. Freiburg (Germany)
HSG-IMIT (Germany)


Published in SPIE Proceedings Vol. 9130:
Micro-Optics 2014
Hugo Thienpont; Jürgen Mohr; Hans Zappe; Hirochika Nakajima, Editor(s)

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