Share Email Print
cover

Proceedings Paper

Investigation of baseline measurement resolution of a Si plate-based extrinsic Fabry-Perot interferometer
Author(s): Nikolai Ushakov; Leonid Liokumovich
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Measurement of a wafer thickness is of a great value for fabrication and interrogation of MEMS/MOEMS devices, as well as conventional optical fiber sensors. In the current paper we investigate the abilities of the wavelength-scanning interferometry techniques for registering the baseline of an extrinsic fiber Fabry-Perot interferometer (EFPI) with the cavity formed by the two sides of a silicon plate. In order to enhance the resolution, an improved signal processing algorithm was developed. Various experiments, including contact and non-contact measurement of a silicon wafer thickness were performed, with the achieved resolutions from 10 to 20 pm. This enables one to use the described approach for high-precision measurement of geometric parameters of micro electro (electro-optic) mechanical systems for their characterization, utilization in sensing tasks and fabrication control. An ability of a Si plate-based EFPI interrogated by the developed technique to capture temperature variations of about 4 mK was demonstrated.

Paper Details

Date Published: 1 May 2014
PDF: 6 pages
Proc. SPIE 9132, Optical Micro- and Nanometrology V, 913214 (1 May 2014); doi: 10.1117/12.2052388
Show Author Affiliations
Nikolai Ushakov, St. Petersburg State Polytechnical Univ. (Russian Federation)
Leonid Liokumovich, St. Petersburg State Polytechnical Univ. (Russian Federation)


Published in SPIE Proceedings Vol. 9132:
Optical Micro- and Nanometrology V
Christophe Gorecki; Anand Krishna Asundi; Wolfgang Osten, Editor(s)

© SPIE. Terms of Use
Back to Top