Share Email Print
cover

Proceedings Paper

Advanced flexible electronics: challenges and opportunities
Author(s): Stephen W. Bedell; Davood Shahrjerdi; Keith Fogel; Paul Lauro; Can Bayram; Bahman Hekmatshoar; Ning Li; John Ott; Devendra Sadana
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Thin, lightweight and flexible electronics are being regarded as an important evolutionary step in the development of novel technological products. Interestingly, this trend has emerged in a wide range of industries; from microelectronics to photovoltaics and even solid state lighting. Historically, most attempts to enable flexibility have focused on the introduction of new material systems that, so far, severely compromise the performance compared to state-of-the-art products. The few approaches that do attempt to render contemporary high-performance materials flexible rely on layer transfer techniques that are complicated, expensive and material-specific. In this paper, we review a method of removing surface layers from brittle substrates called Controlled Spalling Technology that allows one to simple peel material or device layers from their host substrate after they have been fabricated. This allows one to fabricate high-performance electronic products in a manner of their choosing, and make them flexible afterwards. This technique is simple, inexpensive and largely independent of substrate material or size. We demonstrate the power and generality of Controlled Spalling by application to a number of disparate applications including high-performance integrated circuits, high-efficiency photovoltaics and GaN-based solid state lighting.

Paper Details

Date Published: 4 June 2014
PDF: 9 pages
Proc. SPIE 9083, Micro- and Nanotechnology Sensors, Systems, and Applications VI, 90831G (4 June 2014); doi: 10.1117/12.2051716
Show Author Affiliations
Stephen W. Bedell, IBM Thomas J. Watson Research Ctr. (United States)
Davood Shahrjerdi, IBM Thomas J. Watson Research Ctr. (United States)
Keith Fogel, IBM Thomas J. Watson Research Ctr. (United States)
Paul Lauro, IBM Thomas J. Watson Research Ctr. (United States)
Can Bayram, IBM Thomas J. Watson Research Ctr. (United States)
Bahman Hekmatshoar, IBM Thomas J. Watson Research Ctr. (United States)
Ning Li, IBM Thomas J. Watson Research Ctr. (United States)
John Ott, IBM Thomas J. Watson Research Ctr. (United States)
Devendra Sadana, IBM Thomas J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 9083:
Micro- and Nanotechnology Sensors, Systems, and Applications VI
Thomas George; M. Saif Islam; Achyut K. Dutta, Editor(s)

© SPIE. Terms of Use
Back to Top