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Proceedings Paper

Getting small, new 10µm pixel pitch cooled infrared products
Author(s): Y. Reibel; N. Pere-Laperne; T. Augey; L. Rubaldo; G. Decaens; M.-L. Bourqui; A. Manissadjian; D. Billon-Lanfrey; S. Bisotto; O. Gravrand; G. Destefanis; G. Druart; N. Guerineau
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Paper Abstract

Recent advances in miniaturization of IR imaging technology have led to a burgeoning market for mini thermalimaging sensors. Seen in this context our development on smaller pixel pitch has opened the door to very compact products. When this competitive advantage is mixed with smaller coolers, thanks to HOT technology, we achieve valuable reductions in size, weight and power of the overall package. In the same time, we are moving towards a global offer based on digital interfaces that provides our customers lower power consumption and simplification on the IR system design process while freeing up more space. Additionally, we are also investigating new wafer level camera solution taking advantage of the progress in micro-optics. This paper discusses recent developments on hot and small pixel pitch technologies as well as efforts made on compact packaging solution developed by SOFRADIR in collaboration with CEA-LETI and ONERA.

Paper Details

Date Published: 24 June 2014
PDF: 10 pages
Proc. SPIE 9070, Infrared Technology and Applications XL, 907034 (24 June 2014); doi: 10.1117/12.2051654
Show Author Affiliations
Y. Reibel, SOFRADIR (France)
N. Pere-Laperne, SOFRADIR (France)
T. Augey, SOFRADIR (France)
L. Rubaldo, SOFRADIR (France)
G. Decaens, SOFRADIR (France)
M.-L. Bourqui, SOFRADIR (France)
A. Manissadjian, SOFRADIR (France)
D. Billon-Lanfrey, SOFRADIR (France)
S. Bisotto, CEA-LETI-Minatec (France)
O. Gravrand, CEA-LETI-Minatec (France)
G. Destefanis, CEA-LETI-Minatec (France)
G. Druart, ONERA (France)
N. Guerineau, ONERA (France)

Published in SPIE Proceedings Vol. 9070:
Infrared Technology and Applications XL
Bjørn F. Andresen; Gabor F. Fulop; Charles M. Hanson; Paul R. Norton, Editor(s)

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