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Proceedings Paper

Transformational electronics: a powerful way to revolutionize our information world
Author(s): Jhonathan P. Rojas; Galo A. Torres Sevilla; Mohamed T. Ghoneim; Aftab M. Hussain; Sally M. Ahmed; Joanna M. Nassar; Rabab R. Bahabry; Maha Nour; Arwa T. Kutbee; Ernesto Byas; Bidoor Al-Saif; Amal M. Alamri; Muhammad M. Hussain
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Paper Abstract

With the emergence of cloud computation, we are facing the rising waves of big data. It is our time to leverage such opportunity by increasing data usage both by man and machine. We need ultra-mobile computation with high data processing speed, ultra-large memory, energy efficiency and multi-functionality. Additionally, we have to deploy energy-efficient multi-functional 3D ICs for robust cyber-physical system establishment. To achieve such lofty goals we have to mimic human brain, which is inarguably the world’s most powerful and energy efficient computer. Brain’s cortex has folded architecture to increase surface area in an ultra-compact space to contain its neuron and synapses. Therefore, it is imperative to overcome two integration challenges: (i) finding out a low-cost 3D IC fabrication process and (ii) foldable substrates creation with ultra-large-scale-integration of high performance energy efficient electronics. Hence, we show a low-cost generic batch process based on trench-protect-peel-recycle to fabricate rigid and flexible 3D ICs as well as high performance flexible electronics. As of today we have made every single component to make a fully flexible computer including non-planar state-of-the-art FinFETs. Additionally we have demonstrated various solid-state memory, movable MEMS devices, energy harvesting and storage components. To show the versatility of our process, we have extended our process towards other inorganic semiconductor substrates such as silicon germanium and III-V materials. Finally, we report first ever fully flexible programmable silicon based microprocessor towards foldable brain computation and wirelessly programmable stretchable and flexible thermal patch for pain management for smart bionics.

Paper Details

Date Published: 4 June 2014
PDF: 8 pages
Proc. SPIE 9083, Micro- and Nanotechnology Sensors, Systems, and Applications VI, 90831K (4 June 2014); doi: 10.1117/12.2050103
Show Author Affiliations
Jhonathan P. Rojas, King Abdullah Univ. of Science and Technology (Saudi Arabia)
Galo A. Torres Sevilla, King Abdullah Univ. of Science and Technology (Saudi Arabia)
Mohamed T. Ghoneim, King Abdullah Univ. of Science and Technology (Saudi Arabia)
Aftab M. Hussain, King Abdullah Univ. of Science and Technology (Saudi Arabia)
Sally M. Ahmed, King Abdullah Univ. of Science and Technology (Saudi Arabia)
Joanna M. Nassar, King Abdullah Univ. of Science and Technology (Saudi Arabia)
Rabab R. Bahabry, King Abdullah Univ. of Science and Technology (Saudi Arabia)
Maha Nour, King Abdullah Univ. of Science and Technology (Saudi Arabia)
Arwa T. Kutbee, King Abdullah Univ. of Science and Technology (Saudi Arabia)
Ernesto Byas, King Abdullah Univ. of Science and Technology (Saudi Arabia)
Bidoor Al-Saif, King Abdullah Univ. of Science and Technology (Saudi Arabia)
Amal M. Alamri, King Abdullah Univ. of Science and Technology (Saudi Arabia)
Muhammad M. Hussain, King Abdullah Univ. of Science and Technology (Saudi Arabia)


Published in SPIE Proceedings Vol. 9083:
Micro- and Nanotechnology Sensors, Systems, and Applications VI
Thomas George; M. Saif Islam; Achyut K. Dutta, Editor(s)

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