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Proceedings Paper

Investigation of cross-linking poly(methyl methacrylate) as a guiding material in block copolymer directed self-assembly
Author(s): Robert Seidel; Paulina Rincon Delgadillo; Abelardo Ramirez-Hernandez; Hengpeng Wu; Youngjun Her; Jian Yin; Paul Nealey; Juan de Pablo; Roel Gronheid
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Paper Abstract

Directed self-assembly (DDSA) of block copolymers ((BCP) is attracting a growing amount of interest as a techhnique to expand traditional lithography beyond its current limits. It has reecently been demonstrated that chemoepitaxy can be used to successfully ddirect BCP assembly to form large arrays off high-density features. The imec DSA LiNe flow uses lithography and trim-etch to produce a “prepattern” of cross-linked polystyrene (PS) stripes, which in turn guide the formation of assembled BCPP structures. Thhe entire process is predicated on the preferential interaction of the respective BCP domains with particular regionss of the underlying prepattern. The use of polystyrene as the guiding material is not uniquely required, however, and in fact may not even be preferable. This study investigates an alternate chemistry –– crosslinked poly(methyl methacrylate), X-PMMA, –– as the underlying polymer mat, providing a route to higher auto-affinity and therefore a stronger guiding ability. In addition to tthe advantages of the chemistry under investigation, this study explores the broader theme of extending BCP DSA to other materials.

Paper Details

Date Published: 27 March 2014
PDF: 10 pages
Proc. SPIE 9051, Advances in Patterning Materials and Processes XXXI, 90510K (27 March 2014); doi: 10.1117/12.2048179
Show Author Affiliations
Robert Seidel, IMEC (Belgium)
The Univ. of Chicago (United States)
Paulina Rincon Delgadillo, IMEC (Belgium)
The Univ. of Chicago (United States)
Abelardo Ramirez-Hernandez, The Univ. of Chicago (United States)
Hengpeng Wu, AZ Electronic Materials USA Corp. (United States)
Youngjun Her, AZ Electronic Materials USA Corp. (United States)
Jian Yin, AZ Electronic Materials USA Corp. (United States)
Paul Nealey, The Univ. of Chicago (United States)
Juan de Pablo, The Univ. of Chicago (United States)
Roel Gronheid, IMEC (Belgium)


Published in SPIE Proceedings Vol. 9051:
Advances in Patterning Materials and Processes XXXI
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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