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Proceedings Paper

Introduction of an innovative water based photoresist stripping process using intelligent fluids
Author(s): Matthias Rudolph; Xaver Thrun; Dirk Schumann; Anita Hoehne; Silvio Esche; Christoph Hohle
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Paper Abstract

The usage of phasefluid based stripping agents to remove photoresists from silicon substrates was studied. Due to their highly dynamic inner structure phasefluids offer a new working principle, they are penetrating layers through smallest openings and lift off the material from the surface. These non-aggressive stripping fluids were investigated regarding their cleaning efficiency as well as contamination behavior to enable usage in semiconductor and MEMS manufacturing. A general proof of concept for the usage of phasefluids in resist stripping processes is shown on silicon coupons and BKM’s are given for different resist types. In addition a baseline process on 12inch wafers has been developed and characterized in terms of metallic and ionic impurities and defect level.

Paper Details

Date Published: 27 March 2014
PDF: 10 pages
Proc. SPIE 9051, Advances in Patterning Materials and Processes XXXI, 90510T (27 March 2014); doi: 10.1117/12.2048068
Show Author Affiliations
Matthias Rudolph, Fraunhofer-Institut für Photonische Mikrosysteme (Germany)
Xaver Thrun, Fraunhofer-Institut für Photonische Mikrosysteme (Germany)
Dirk Schumann, bubbles and beyond GmbH (Germany)
Anita Hoehne, bubbles and beyond GmbH (Germany)
Silvio Esche, bubbles and beyond GmbH (Germany)
Christoph Hohle, Fraunhofer-Institut für Photonische Mikrosysteme (Germany)


Published in SPIE Proceedings Vol. 9051:
Advances in Patterning Materials and Processes XXXI
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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