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Proceedings Paper

Hybrid OPC modeling with SEM contour technique for 10nm node process
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Paper Abstract

Hybrid OPC modeling is investigated using both CDs from 1D and simple 2D structures and contours extracted from complex 2D structures, which are obtained by a Critical Dimension-Scanning Electron Microscope (CD-SEM). Recent studies have addressed some of key issues needed for the implementation of contour extraction, including an edge detection algorithm consistent with conventional CD measurements, contour averaging and contour alignment. Firstly, pattern contours obtained from CD-SEM images were used to complement traditional site driven CD metrology for the calibration of OPC models for both metal and contact layers of 10 nm-node logic device, developed in Albany Nano-Tech. The accuracy of hybrid OPC model was compared with that of conventional OPC model, which was created with only CD data. Accuracy of the model, defined as total error root-mean-square (RMS), was improved by 23% with the use of hybrid OPC modeling for contact layer and 18% for metal layer, respectively. Pattern specific benefit of hybrid modeling was also examined. Resist shrink correction was applied to contours extracted from CD-SEM images in order to improve accuracy of the contours, and shrink corrected contours were used for OPC modeling. The accuracy of OPC model with shrink correction was compared with that without shrink correction, and total error RMS was decreased by 0.2nm (12%) with shrink correction technique. Variation of model accuracy among 8 modeling runs with different model calibration patterns was reduced by applying shrink correction. The shrink correction of contours can improve accuracy and stability of OPC model.

Paper Details

Date Published: 31 March 2014
PDF: 9 pages
Proc. SPIE 9052, Optical Microlithography XXVII, 90520W (31 March 2014); doi: 10.1117/12.2047678
Show Author Affiliations
Keiichiro Hitomi, Hitachi America, Ltd. (United States)
Scott Halle, IBM Corp. (United States)
Marshal Miller, IBM Corp. (United States)
Ioana Graur, IBM Corp. (United States)
Nicole Saulnier, IBM Corp. (United States)
Derren Dunn, IBM Corp. (United States)
Nobuhiro Okai, Hitachi America, Ltd. (United States)
Shoji Hotta, Hitachi, Ltd. (Japan)
Atsuko Yamaguchi, Hitachi, Ltd. (Japan)
Hitoshi Komuro, Hitachi High-Technologies Corp. (Japan)
Toru Ishimoto, Hitachi High-Technologies Corp. (Japan)
Shunsuke Koshihara, Hitachi High-Technologies Corp. (Japan)
Yutaka Hojo, Hitachi High-Technologies Corp. (Japan)


Published in SPIE Proceedings Vol. 9052:
Optical Microlithography XXVII
Kafai Lai; Andreas Erdmann, Editor(s)

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