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Proceedings Paper

Comparative defect classifications and analysis of Lasertec's M1350 and M7360
Author(s): Milton Godwin; Dave Balachandran; Tomoya Tamura; Anwei Jia
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Paper Abstract

Defect classification and characterization on mask substrates and blanks can be used to the identify defect sources within the tool and process. Defect reduction has been achieved in SEMATECH’s EUV Mask Blank Development Center (MBDC), aided by successful classifications of defect populations. Failure analysis of EUV substrate and blank defects in the MBDC begins with automatic classification of defects detected by M1350 and M7360 Lasertec inspection tools. Two sets of defect images and classification emerge from the two detection tools. The M1350 provides a more variegated set of 13 defect class types, while the M7360 provides eight. During manual review of the classifications, the defect class sets for both tools are often collapsed to only two major classes of interests with respect to production and failure analysis: particles and pits. This leaves various other classes ignored before subsequent characterization steps like SEM classification and composition analysis. The usefulness of tracking and verifying more detailed classes of defect needs to be explored. SEM analysis can be used to validate the relative size comparison yielded from inspection data alone, beyond the calibrated comparison of inspection signals from well-understood polystyrene latex spheres. The accuracy of rule-based defect classification of inspection tool data must be quantified by statistical tracking and validation SEM analysis. Classification of false counts increases as sensitivity of detection tools are increased to ensure the capture of smallest defects. The validity of calling a defect “false” is usually a manual review of pixel images created on the detection tool.

Paper Details

Date Published: 2 April 2014
PDF: 16 pages
Proc. SPIE 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII, 90502Z (2 April 2014); doi: 10.1117/12.2047659
Show Author Affiliations
Milton Godwin, SEMATECH Inc. (United States)
Dave Balachandran, SEMATECH Inc. (United States)
Tomoya Tamura, Lasertec Corp. (Japan)
Anwei Jia, Lasertec USA Inc. (United States)


Published in SPIE Proceedings Vol. 9050:
Metrology, Inspection, and Process Control for Microlithography XXVIII
Jason P. Cain; Martha I. Sanchez, Editor(s)

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