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Proceedings Paper

2D and 3D heterogeneous photonic integrated circuits
Author(s): S. J. Ben Yoo
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Paper Abstract

Exponential increases in the amount of data that need to be sensed, communicated, and processed are continuing to drive the complexity of our computing, networking, and sensing systems. High degrees of integration is essential in scalable, practical, and cost-effective microsystems. In electronics, high-density 2D integration has naturally evolved towards 3D integration by stacking of memory and processor chips with through-silicon-vias. In photonics, too, we anticipate highdegrees of 3D integration of photonic components to become a prevailing method in realizing future microsystems for information and communication technologies. However, compared to electronics, photonic 3D integration face a number of challenges. This paper will review two methods of 3D photonic integration --- fs laser inscription and layer stacking, and discuss applications and future prospects.

Paper Details

Date Published: 8 March 2014
PDF: 9 pages
Proc. SPIE 8989, Smart Photonic and Optoelectronic Integrated Circuits XVI, 89890A (8 March 2014); doi: 10.1117/12.2047502
Show Author Affiliations
S. J. Ben Yoo, Univ. of California, Davis (United States)


Published in SPIE Proceedings Vol. 8989:
Smart Photonic and Optoelectronic Integrated Circuits XVI
Louay A. Eldada; El-Hang Lee; Sailing He, Editor(s)

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