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Proceedings Paper

Technology-design-manufacturing co-optimization for advanced mobile SoCs
Author(s): Da Yang; Chock Gan; P. R. Chidambaram; Giri Nallapadi; John Zhu; S. C. Song; Jeff Xu; Geoffrey Yeap
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Paper Abstract

How to maintain the Moore’s Law scaling beyond the 193 immersion resolution limit is the key question semiconductor industry needs to answer in the near future. Process complexity will undoubtfully increase for 14nm node and beyond, which brings both challenges and opportunities for technology development. A vertically integrated design-technologymanufacturing co-optimization flow is desired to better address the complicated issues new process changes bring. In recent years smart mobile wireless devices have been the fastest growing consumer electronics market. Advanced mobile devices such as smartphones are complex systems with the overriding objective of providing the best userexperience value by harnessing all the technology innovations. Most critical system drivers are better system performance/power efficiency, cost effectiveness, and smaller form factors, which, in turns, drive the need of system design and solution with More-than-Moore innovations. Mobile system-on-chips (SoCs) has become the leading driver for semiconductor technology definition and manufacturing. Here we highlight how the co-optimization strategy influenced architecture, device/circuit, process technology and package, in the face of growing process cost/complexity and variability as well as design rule restrictions.

Paper Details

Date Published: 28 March 2014
PDF: 10 pages
Proc. SPIE 9053, Design-Process-Technology Co-optimization for Manufacturability VIII, 90530N (28 March 2014); doi: 10.1117/12.2047370
Show Author Affiliations
Da Yang, Qualcomm Technologies Inc. (United States)
Chock Gan, Qualcomm Technologies Inc. (United States)
P. R. Chidambaram, Qualcomm Technologies Inc. (United States)
Giri Nallapadi, Qualcomm Technologies Inc. (United States)
John Zhu, Qualcomm Technologies Inc. (United States)
S. C. Song, Qualcomm Technologies Inc. (United States)
Jeff Xu, Qualcomm Technologies Inc. (United States)
Geoffrey Yeap, Qualcomm Technologies Inc. (United States)

Published in SPIE Proceedings Vol. 9053:
Design-Process-Technology Co-optimization for Manufacturability VIII
John L. Sturtevant; Luigi Capodieci, Editor(s)

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