Share Email Print

Proceedings Paper

Strength and fatigue life evaluation of composite laminate with embedded sensors
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Prognosis regarding durability of composite structures using various Structural Health Monitoring (SHM) techniques is an important and challenging topic of research. Ultrasonic SHM systems with embedded transducers have potential application here due to their instant monitoring capability, compact packaging potential toward unobtrusiveness and noninvasiveness as compared to non-contact ultrasonic and eddy current techniques which require disassembly of the structure. However, embedded sensors pose a risk to the structure by acting as a flaw thereby reducing life. The present paper focuses on the determination of strength and fatigue life of the composite laminate with embedded film sensors like CNT nanocomposite, PVDF thin films and piezoceramic films. First, the techniques of embedding these sensors in composite laminates is described followed by the determination of static strength and fatigue life at coupon level testing in Universal Testing Machine (UTM). Failure mechanisms of the composite laminate with embedded sensors are studied for static and dynamic loading cases. The coupons are monitored for loading and failure using the embedded sensors. A comparison of the performance of these three types of embedded sensors is made to study their suitability in various applications. These three types of embedded sensors cover a wide variety of applications, and prove to be viable in embedded sensor based SHM of composite structures.

Paper Details

Date Published: 10 April 2014
PDF: 10 pages
Proc. SPIE 9062, Smart Sensor Phenomena, Technology, Networks, and Systems Integration 2014, 90620X (10 April 2014); doi: 10.1117/12.2047323
Show Author Affiliations
Vivek T. Rathod, Indian Institute of Science (India)
S. R. Hiremath, Indian Institute of Science (India)
D. Roy Mahapatra, Indian Institute of Science (India)

Published in SPIE Proceedings Vol. 9062:
Smart Sensor Phenomena, Technology, Networks, and Systems Integration 2014
Wolfgang Ecke; Kara J. Peters; Norbert G. Meyendorf; Theodoros E. Matikas, Editor(s)

© SPIE. Terms of Use
Back to Top