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Proceedings Paper

Wafer sub-layer impact in OPC/ORC models for advanced node implant layers
Author(s): Jean-Christophe Le-Denmat; Jean-Christophe Michel; Elodie Sungauer; Emek Yesilada; Frederic Robert; Song Lan; Mu Feng; Lei Wang; Laurent Depre; Sanjay Kapasi
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Paper Abstract

From 28 nm technology node and below optical proximity correction (OPC) needs to take into account light scattering effects from prior layers when bottom anti-reflective coating (BARC) is not used, which is typical for ionic implantation layers. These effects are complex, especially when multiple sub layers have to be considered: for instance active and poly structures need to be accounted for. A new model form has been developed to address this wafer topography during model calibration called the wafer 3D+ or W3D+ model. This model can then be used in verification (using Tachyon LMC) and during model based OPC to increase the accuracy of mask correction and verification. This paper discusses an exploration of this new model results using extended wafer measurements (including SEM). Current results show good accuracy on various representative structures.

Paper Details

Date Published: 31 March 2014
PDF: 9 pages
Proc. SPIE 9052, Optical Microlithography XXVII, 90520D (31 March 2014); doi: 10.1117/12.2047115
Show Author Affiliations
Jean-Christophe Le-Denmat, STMicroelectronics (France)
Jean-Christophe Michel, STMicroelectronics (France)
Elodie Sungauer, STMicroelectronics (France)
Emek Yesilada, STMicroelectronics (France)
Frederic Robert, STMicroelectronics (France)
Song Lan, ASML Brion (United States)
Mu Feng, ASML Brion (United States)
Lei Wang, ASML Brion (United States)
Laurent Depre, ASML Brion (United States)
Sanjay Kapasi, ASML Brion (United States)


Published in SPIE Proceedings Vol. 9052:
Optical Microlithography XXVII
Kafai Lai; Andreas Erdmann, Editor(s)

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