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Proceedings Paper

Improving on-product performance at litho using integrated diffraction-based metrology and computationally designed device-like targets fit for advanced technologies (incl. FinFET)
Author(s): Kai-Hsiung Chen; GT Huang; KS Chen; C. W. Hsieh; YC Chen; CM Ke; TS Gau; YC Ku; Kaustuve Bhattacharyya; Jacky Huang; Arie den Boef; Maurits v. d. Schaar; Martijn Maassen; Reinder Plug; Youping Zhang; Steffen Meyer; Martijn van Veen; Chris de Ruiter; Jon Wu; Hua Xu; Tatung Chow; Charlie Chen; Eric Verhoeven; Pu Li; Paul Hinnen; Greet Storms; Kelvin Pao; Gary Zhang; Christophe Fouquet; Takuya Mori
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Paper Abstract

In order to meet current and future node overlay, CD and focus requirements, metrology and process control performance need to be continuously improved. In addition, more complex lithography techniques, such as double patterning, advanced device designs, such as FinFET, as well as advanced materials like hardmasks, pose new challenges for metrology and process control. In this publication several systematic steps are taken to face these challenges.

Paper Details

Date Published: 2 April 2014
PDF: 10 pages
Proc. SPIE 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII, 90500S (2 April 2014); doi: 10.1117/12.2047098
Show Author Affiliations
Kai-Hsiung Chen, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
GT Huang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
KS Chen, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
C. W. Hsieh, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
YC Chen, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
CM Ke, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
TS Gau, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
YC Ku, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Kaustuve Bhattacharyya, ASML Netherlands B.V. (Netherlands)
Jacky Huang, ASML Netherlands B.V. (Netherlands)
Arie den Boef, ASML Netherlands B.V. (Netherlands)
Maurits v. d. Schaar, ASML Netherlands B.V. (Netherlands)
Martijn Maassen, ASML Netherlands B.V. (Netherlands)
Reinder Plug, ASML Netherlands B.V. (Netherlands)
Youping Zhang, ASML Netherlands B.V. (Netherlands)
Steffen Meyer, ASML Netherlands B.V. (Netherlands)
Martijn van Veen, ASML Netherlands B.V. (Netherlands)
Chris de Ruiter, ASML Netherlands B.V. (Netherlands)
Jon Wu, ASML Netherlands B.V. (Netherlands)
Hua Xu, ASML Netherlands B.V. (Netherlands)
Tatung Chow, ASML Netherlands B.V. (Netherlands)
Charlie Chen, ASML Netherlands B.V. (Netherlands)
Eric Verhoeven, ASML Netherlands B.V. (Netherlands)
Pu Li, ASML Netherlands B.V. (Netherlands)
Paul Hinnen, ASML Netherlands B.V. (Netherlands)
Greet Storms, ASML Netherlands B.V. (Netherlands)
Kelvin Pao, ASML Netherlands B.V. (Netherlands)
Gary Zhang, ASML Netherlands B.V. (Netherlands)
Christophe Fouquet, ASML Netherlands B.V. (Netherlands)
Takuya Mori, Tokyo Electron Ltd. (Japan)


Published in SPIE Proceedings Vol. 9050:
Metrology, Inspection, and Process Control for Microlithography XXVIII
Jason P. Cain; Martha I. Sanchez, Editor(s)

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