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Proceedings Paper

20nm MOL overlay case study
Author(s): Lokesh Subramany; Michael Hsieh; Chen Li; Hui Peng Koh; David Cho; Anna Golotsvan; Vidya Ramanathan; Ramkumar Karur Shanmugam; Lipkong Yap
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Paper Abstract

As the process nodes continue to shrink, overlay budgets are approaching theoretical performance of the tools. It becomes even more imperative to improve overlay performance in order to maintain the roadmap for advance integrated circuit manufacturing. One of the critical factors in 20nm manufacturing is the overlay performance between the Middle of Line (MOL) and the Poly layer. The margin between these two layers was a process limiter, it was essential that we maintain a very tight overlay control between these layers. Due to various process and metrology related effects, maintaining good overlay control became a challenge. In this paper we describe the various factors affecting overlay performance and the measures taken to mitigate or eliminate said factors to improve overlay performance.

Paper Details

Date Published: 2 April 2014
PDF: 8 pages
Proc. SPIE 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII, 90502Q (2 April 2014); doi: 10.1117/12.2046598
Show Author Affiliations
Lokesh Subramany, GLOBALFOUNDRIES Inc. (United States)
Michael Hsieh, GLOBALFOUNDRIES Inc. (United States)
Chen Li, GLOBALFOUNDRIES Inc. (United States)
Hui Peng Koh, GLOBALFOUNDRIES Inc. (United States)
David Cho, GLOBALFOUNDRIES Inc. (United States)
Anna Golotsvan, KLA-Tencor Corp. (United States)
Vidya Ramanathan, KLA-Tencor Corp. (United States)
Ramkumar Karur Shanmugam, KLA-Tencor Corp. (United States)
Lipkong Yap, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 9050:
Metrology, Inspection, and Process Control for Microlithography XXVIII
Jason P. Cain; Martha I. Sanchez, Editor(s)

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