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Proceedings Paper

Wet particle source identification and reduction using a new filter cleaning process
Author(s): Toru Umeda; Akihiko Morita; Hideki Shimizu; Shuichi Tsuzuki
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Paper Abstract

Wet particle reduction during filter installation and start-up aligns closely with initiatives to reduce both chemical consumption and preventative maintenance time. The present study focuses on the effects of filter materials cleanliness on wet particle defectivity through evaluation of filters that have been treated with a new enhanced cleaning process focused on organic compounds reduction. Little difference in filter performance is observed between the two filter types at a size detection threshold of 60 nm, while clear differences are observed at that of 26 nm. It can be suggested that organic compounds can be identified as a potential source of wet particles. Pall recommends filters that have been treated with the special cleaning process for applications with a critical defect size of less than 60 nm. Standard filter products are capable to satisfy wet particle defect performance criteria in less critical lithography applications.

Paper Details

Date Published: 27 March 2014
PDF: 8 pages
Proc. SPIE 9051, Advances in Patterning Materials and Processes XXXI, 90511F (27 March 2014); doi: 10.1117/12.2046560
Show Author Affiliations
Toru Umeda, Nihon Pall Ltd. (Japan)
Akihiko Morita, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Hideki Shimizu, Dainippon Screen Manufacturing Co., Ltd. (Japan)
Shuichi Tsuzuki, Nihon Pall Ltd. (Japan)

Published in SPIE Proceedings Vol. 9051:
Advances in Patterning Materials and Processes XXXI
Thomas I. Wallow; Christoph K. Hohle, Editor(s)

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