Share Email Print
cover

Proceedings Paper

Update on the SEMATECH 0.5 NA Extreme-Ultraviolet Lithography (EUVL) Microfield Exposure Tool (MET)
Author(s): Kevin Cummings; Dominic Ashworth; Mark Bremer; Rodney Chin; Yu-Jen Fan; Luc Girard; Holger Glatzel; Michael Goldstein; Eric Gullikson; Jim Kennon; Bob Kestner; Lou Marchetti; Patrick Naulleau; Regina Soufli; Johannes Bauer; Markus Mengel; Joachim Welker; Michael Grupp; Erik Sohmen; Stefan Wurm
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

In support of the Extreme Ultraviolet Lithography (EUVL) roadmap, a SEMATECH/CNSE joint program is underway to produce multiple EUVL (wavelength of 13.5 nm) R&D photolithography tools. The 0.5 NA projection optic magnification (5X), track length and mechanical interfaces match the currently installed 0.3 NA micro-field exposure tools (MET) projection optic [1] [2] [3]. Therefore, significant changes to the current tool platforms and other adjacent modules are not necessary. However, many of the existing systems do need upgrades to achieve the anticipated smaller exposure feature sizes [4]. To date we have made considerable progress in the production of the first of the two-mirror 0.5 NA projection optics for EUVL [5]. With a measured transmitted wave front error of less than 1 nm root mean square (RMS) over its 30 μm × 200 μm image field, lithography modeling shows that a predicted resolution of ≤12 nm and an ultimate resolution of 8 nm (with extreme dipole illumination) will be possible.

This paper will present an update from the 0.5 NA EUVL program. We will detail the more significant activities that are being undertaken to upgrade the MET and discuss expected performance.

Paper Details

Date Published: 17 April 2014
PDF: 9 pages
Proc. SPIE 9048, Extreme Ultraviolet (EUV) Lithography V, 90481M (17 April 2014); doi: 10.1117/12.2046380
Show Author Affiliations
Kevin Cummings, SEMATECH Inc. (United States)
Dominic Ashworth, SEMATECH Inc. (United States)
Mark Bremer, Zygo Corp. (United States)
Rodney Chin, Zygo Corp. (United States)
Yu-Jen Fan, SEMATECH Inc. (United States)
Luc Girard, Zygo Corp. (United States)
Holger Glatzel, Zygo Corp. (United States)
Michael Goldstein, SEMATECH Inc. (United States)
Eric Gullikson, Lawrence Berkeley National Lab. (United States)
Jim Kennon, Zygo Corp. (United States)
Bob Kestner, Zygo Corp. (United States)
Lou Marchetti, Zygo Corp. (United States)
Patrick Naulleau, Lawrence Berkeley National Lab. (United States)
Regina Soufli, Lawrence Livermore National Lab. (United States)
Johannes Bauer, Carl Zeiss SMT GmbH (Germany)
Markus Mengel, Carl Zeiss SMT GmbH (Germany)
Joachim Welker, Carl Zeiss SMT GmbH (Germany)
Michael Grupp, Carl Zeiss SMT GmbH (Germany)
Erik Sohmen, Carl Zeiss SMT GmbH (Germany)
Stefan Wurm, SEMATECH Inc. (United States)


Published in SPIE Proceedings Vol. 9048:
Extreme Ultraviolet (EUV) Lithography V
Obert R. Wood; Eric M. Panning, Editor(s)

© SPIE. Terms of Use
Back to Top