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Proceedings Paper

Glass ceramic ZERODUR® enabling nanometer precision
Author(s): Ralf Jedamzik; Clemens Kunisch; Johannes Nieder; Thomas Westerhoff
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Paper Abstract

The IC Lithography roadmap foresees manufacturing of devices with critical dimension of < 20 nm. Overlay specification of single digit nanometer asking for nanometer positioning accuracy requiring sub nanometer position measurement accuracy. The glass ceramic ZERODUR® is a well-established material in critical components of microlithography wafer stepper and offered with an extremely low coefficient of thermal expansion (CTE), the tightest tolerance available on market. SCHOTT is continuously improving manufacturing processes and it’s method to measure and characterize the CTE behavior of ZERODUR® to full fill the ever tighter CTE specification for wafer stepper components. In this paper we present the ZERODUR® Lithography Roadmap on the CTE metrology and tolerance. Additionally, simulation calculations based on a physical model are presented predicting the long term CTE behavior of ZERODUR® components to optimize dimensional stability of precision positioning devices. CTE data of several low thermal expansion materials are compared regarding their temperature dependence between - 50°C and + 100°C. ZERODUR® TAILORED 22°C is full filling the tight CTE tolerance of +/- 10 ppb / K within the broadest temperature interval compared to all other materials of this investigation. The data presented in this paper explicitly demonstrates the capability of ZERODUR® to enable the nanometer precision required for future generation of lithography equipment and processes.

Paper Details

Date Published: 31 March 2014
PDF: 10 pages
Proc. SPIE 9052, Optical Microlithography XXVII, 90522I (31 March 2014); doi: 10.1117/12.2046352
Show Author Affiliations
Ralf Jedamzik, SCHOTT AG (Germany)
Clemens Kunisch, SCHOTT AG (Germany)
Johannes Nieder, SCHOTT AG (Germany)
Thomas Westerhoff, SCHOTT AG (Germany)

Published in SPIE Proceedings Vol. 9052:
Optical Microlithography XXVII
Kafai Lai; Andreas Erdmann, Editor(s)

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