Share Email Print

Proceedings Paper

Lithographic process window optimization for mask aligner proximity lithography
Author(s): Reinhard Voelkel; Uwe Vogler; Arianna Bramati; Andreas Erdmann; Nezih Ünal; Ulrich Hofmann; Marc Hennemeyer; Ralph Zoberbier; David Nguyen; Juergen Brugger
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We introduce a complete methodology for process window optimization in proximity mask aligner lithography. The commercially available lithography simulation software LAB from GenISys GmbH was used for simulation of light propagation and 3D resist development. The methodology was tested for the practical example of lines and spaces, 5 micron half-pitch, printed in a 1 micron thick layer of AZ® 1512HS1 positive photoresist on a silicon wafer. A SUSS MicroTec MA8 mask aligner, equipped with MO Exposure Optics® was used in simulation and experiment. MO Exposure Optics® is the latest generation of illumination systems for mask aligners. MO Exposure Optics® provides telecentric illumination and excellent light uniformity over the full mask field. MO Exposure Optics® allows the lithography engineer to freely shape the angular spectrum of the illumination light (customized illumination), which is a mandatory requirement for process window optimization. Three different illumination settings have been tested for 0 to 100 micron proximity gap. The results obtained prove, that the introduced process window methodology is a major step forward to obtain more robust processes in mask aligner lithography. The most remarkable outcome of the presented study is that a smaller exposure gap does not automatically lead to better print results in proximity lithography - what the “good instinct” of a lithographer would expect. With more than 5'000 mask aligners installed in research and industry worldwide, the proposed process window methodology might have significant impact on yield improvement and cost saving in industry.

Paper Details

Date Published: 31 March 2014
PDF: 11 pages
Proc. SPIE 9052, Optical Microlithography XXVII, 90520G (31 March 2014); doi: 10.1117/12.2046332
Show Author Affiliations
Reinhard Voelkel, SUSS MicroOptics SA (Switzerland)
Uwe Vogler, SUSS MicroOptics SA (Switzerland)
Arianna Bramati, SUSS MicroOptics SA (Switzerland)
Andreas Erdmann, Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany)
Nezih Ünal, GenISys GmbH (Germany)
Ulrich Hofmann, GenISys GmbH (Germany)
Marc Hennemeyer, SUSS MicroTec Lithography GmbH (Germany)
Ralph Zoberbier, SUSS MicroTec Lithography GmbH (Germany)
David Nguyen, Ecole Polytechnique Fédérale de Lausanne (Switzerland)
Juergen Brugger, Ecole Polytechnique Fédérale de Lausanne (Switzerland)

Published in SPIE Proceedings Vol. 9052:
Optical Microlithography XXVII
Kafai Lai; Andreas Erdmann, Editor(s)

© SPIE. Terms of Use
Back to Top