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Proceedings Paper

Self-assembly of high-resolutions PS-b-PMMA block-copolymers: processes capabilities and integration on 300mm track
Author(s): X. Chevalier; C. Nicolet; R. Tiron; A. Gharbi; G. Chamiot-Maitral; K. Jullian; P. Pimenta-Barros; M. Argoud; J.-L. Peyre; R. Van Spaandonk; G. Fleury; G. Hadziioannou; C. Navarro
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Paper Abstract

Careful control and reproducibility of BCP’s synthesis are mandatory parameters to push-down PS-b-PMMA block-copolymer systems toward its lowest dimensions for microelectronic applications. The self-assembly process optimization of different high-resolution cylindrical PS-b-PMMA block-copolymers (i.e. L0 period below 25 nm) is studied to highlight processes-variations as regard to more classical PS-b-PMMA systems while the characterizations of bulk materials provide deeper insights on the parameters addressing the self-assembly of such materials. The integration of a high-resolution BCP on 300 mm track is then studied to check the capabilities of such materials in terms of lithographic applications. CD uniformity measurements in contact hole shrink approach, as well as the transfer of the BCP mask into typical industrial under-layer stacks leading to aggressive features, show that these materials exhibit promising potentials for advanced lithographic nodes.

Paper Details

Date Published: 28 March 2014
PDF: 10 pages
Proc. SPIE 9049, Alternative Lithographic Technologies VI, 90490Y (28 March 2014); doi: 10.1117/12.2046313
Show Author Affiliations
X. Chevalier, Arkema S.A. (France)
C. Nicolet, Arkema S.A. (France)
R. Tiron, CEA-LETI (France)
A. Gharbi, CEA-LETI (France)
G. Chamiot-Maitral, CEA-LETI (France)
K. Jullian, CEA-LETI (France)
P. Pimenta-Barros, CEA-LETI (France)
M. Argoud, CEA-LETI (France)
J.-L. Peyre, Tokyo Electron Europe Ltd. (France)
R. Van Spaandonk, Tokyo Electron Europe Ltd. (France)
G. Fleury, LCPO, CNRS, Univ. Bordeaux 1 (France)
G. Hadziioannou, LCPO, CNRS, Univ. Bordeaux 1 (France)
C. Navarro, Arkema S.A. (France)

Published in SPIE Proceedings Vol. 9049:
Alternative Lithographic Technologies VI
Douglas J. Resnick; Christopher Bencher, Editor(s)

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