Share Email Print

Proceedings Paper

The economic impact of EUV lithography on critical process modules
Author(s): Arindam Mallik; Naoto Horiguchi; Jürgen Bömmels; Aaron Thean; Kathy Barla; Geert Vandenberghe; Kurt Ronse; Julien Ryckaert; Abdelkarim Mercha; Laith Altimime; Diederik Verkest; An Steegen
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Traditionally, semiconductor density scaling has been supported by optical lithography. The ability of the exposure tools to provide shorter exposure wavelengths or higher numerical apertures have allowed optical lithography be on the forefront of dimensional scaling for the semiconductor industry. Unfortunately, the roadmap for lithography is currently at a juncture of a major paradigm shift. EUV Lithography is steadily maturing but not fully ready to be inserted into HVM. Unfortunately, there are no alternative litho candidates on the horizon that can take over from 193nm. As a result, it is important to look into the insertion point of EUV that would be ideal for the industry from an economical perspective. This paper details the benefit observed by such a transition. Furthermore, it looks into such detail with an EUV throughput sensitivity study.

Paper Details

Date Published: 17 April 2014
PDF: 12 pages
Proc. SPIE 9048, Extreme Ultraviolet (EUV) Lithography V, 90481R (17 April 2014); doi: 10.1117/12.2046310
Show Author Affiliations
Arindam Mallik, IMEC (Belgium)
Naoto Horiguchi, IMEC (Belgium)
Jürgen Bömmels, IMEC (Belgium)
Aaron Thean, IMEC (Belgium)
Kathy Barla, IMEC (Belgium)
Geert Vandenberghe, IMEC (Belgium)
Kurt Ronse, IMEC (Belgium)
Julien Ryckaert, IMEC (Belgium)
Abdelkarim Mercha, IMEC (Belgium)
Laith Altimime, IMEC (Belgium)
Diederik Verkest, IMEC (Belgium)
An Steegen, IMEC (Belgium)

Published in SPIE Proceedings Vol. 9048:
Extreme Ultraviolet (EUV) Lithography V
Obert R. Wood; Eric M. Panning, Editor(s)

© SPIE. Terms of Use
Back to Top