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Proceedings Paper

New lithography technology for sub-10nm patterning with shrinking organic material
Author(s): Seiji Morita
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Paper Abstract

For making sub-10nm patterns, new lithography technology is proposed in this paper. This is a cost-effective new lithography process using the special organic material which is able to reduce a pattern size by shrinking. Shrinking ratio of various methods, decreasing line edge roughness (LER) and patterning of less than 10nm half pitch size are reported.

Paper Details

Date Published: 28 March 2014
PDF: 7 pages
Proc. SPIE 9049, Alternative Lithographic Technologies VI, 90491I (28 March 2014); doi: 10.1117/12.2046307
Show Author Affiliations
Seiji Morita, Toshiba Corp. (Japan)

Published in SPIE Proceedings Vol. 9049:
Alternative Lithographic Technologies VI
Douglas J. Resnick; Christopher Bencher, Editor(s)

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