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Proceedings Paper

Configurable hot spot fixing system
Author(s): Masanari Kajiwara; Sachiko Kobayashi; Hiromitsu Mashita; Ryota Aburada; Nozomu Furuta; Toshiya Kotani
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Paper Abstract

Hot spot fixing (HSF) method has been used to fix many hot spots automatically. However, conventional HSF based on a biasing based modification is difficult to fix many hot spots under a low-k1 lithography condition. In this paper we proposed a new HSF, called configurable hotspot fixing system. The HSF has two major concepts. One is a new function to utilize vacant space around a hot spot by adding new patterns or extending line end edges around the hot spot. The other is to evaluate many candidates at a time generated by the new functions. We confirmed the proposed HSF improves 73% on the number of fixing hot spots and reduces total fixing time by 50% on a device layout equivalent to 28nm-node. The result shows the proposed HSF is effective for layouts under the low-k1 lithography condition.

Paper Details

Date Published: 28 March 2014
PDF: 8 pages
Proc. SPIE 9053, Design-Process-Technology Co-optimization for Manufacturability VIII, 90530G (28 March 2014); doi: 10.1117/12.2046272
Show Author Affiliations
Masanari Kajiwara, Toshiba Corp. (Japan)
Sachiko Kobayashi, Toshiba Corp. (Japan)
Hiromitsu Mashita, Toshiba Corp. (Japan)
Ryota Aburada, Toshiba Corp. (Japan)
Nozomu Furuta, Toshiba Corp. (Japan)
Toshiya Kotani, Toshiba Corp. (Japan)

Published in SPIE Proceedings Vol. 9053:
Design-Process-Technology Co-optimization for Manufacturability VIII
John L. Sturtevant; Luigi Capodieci, Editor(s)

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