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Proceedings Paper

Self-aligned double-patterning plasma etch challenges
Author(s): Rich Wise; John Arnold; Siva Kanakasabapathy; Massud Aminpur
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Proc. SPIE 9054, Advanced Etch Technology for Nanopatterning III, 90540L; doi: 10.1117/12.2046266
Show Author Affiliations
Rich Wise, IBM Corp. (United States)
John Arnold, IBM Corp. (United States)
Siva Kanakasabapathy, IBM Corp. (United States)
Massud Aminpur, IBM Corp. (United States)


Published in SPIE Proceedings Vol. 9054:
Advanced Etch Technology for Nanopatterning III
Gottlieb S. Oehrlein; Qinghuang Lin; Ying Zhang, Editor(s)

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